Die attach materials form the cornerstone of reliable power electronic packaging, providing the essential bond between semiconductor devices and their substrates. Recent advances have focused on ...

QPT just filed a patent for the “qAttach” process, a novel way to attach dies to heat spreaders or substrates (typically aluminum nitride (AlN)) that significantly reduces thermal resistance. The new ...

The power electronics industry is facing a problem in that, as the power handled by transistors increases to meet the needs of new applications, the packaging will increasingly struggle to remove the ...

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In this study, the layered anisotropic structure of β-Li₂TiO₃ enables preferential dislocation slip under high pressure, amplified by nanoscale stress concentration, driving plastic deformation to ...

Additive manufacturing, or 3D printing, is the process of turning digital designs into three-dimensional objects. It is a convenient and affordable way to make prototypes as well as finished products, ...

A new techno-economic analysis shows that the energy intensive ceramic industry would gain both financial and environmental benefits if it moved to free the cold sintering process from languishing in ...

Lithium-ion batteries have been a staple in device manufacturing for years, but the liquid electrolytes they rely on to function are quite unstable, leading to fire hazards and safety concerns. Now, ...